iPad 3 Release Date

It is surprising why the latest source code for the default compiler in Apple’s Xcode developer tools shows support for Marvell’s quad-core, ARM-based Armada XP processor. As we know, Marvell is targeting the processor for low-power cloud computing applications. This was inadvertently discovered by a developer who works on a low-level ARM assembly coding for security products.

While we cannot posit any definite answer, we can try to make a few educated guesses why something like this would be done. Having optional support for the Armada XP is something fascinating.

First, we think Apple could be considering the Marvell for the iPad 3, along with next-generation iOS devices. Since it is possible that NVIDIA may have its “Kal-El” quad-core Tegra 3 processors  next year to run Android-based mobile devices with impressive processing power akin to a desktop, Marvell’s Armada processors will be able to approximate a similar kind of performance.

Second, the Marvell is a good choice for a processor that is low powered and enhances batterly life, perfect for the MacBook Air. While gossip seems to suggest that a move to ARM for the Mac Air, the performance based on the watts used of the processor is not that attractive. Also, sticking with Intel would mean that there would be no need for Apple to convince app developers to recompile their software.

Maybe Apple would be using the Marvell chip in prototypes of future iOS device designs for testing purposes. Think about it. An Armada XP-powered prototype logic board would also allow iOS or Mac OS X software engineers to test performance tuning. Meanwhile, Apple’s hardware design team could continue testing a possible quad-core ARM design. The reals reason is to ensure that it remains competitive in the mobile device market, when circumstances demand it to be.

While 2012 means a lot of things to many people, this is also the year when we can expect the iPad to sport Apple’s latest chip tech. There’s nothing easy when releasing new processor technology. If it was hard for Intel, then Apple would be no exception. The Linley Group, a chip consulting firm, claims that the “A6” would not appear in the iPad 3 sooner than 2012.

According to Linley Group senior analyst Kevin Krewell, the A6 not only contains four processor cores, but will also utilize 3D technology. The previous Apple processor, A5, only has 2 cores. Krewell was cited in the Taiwan Economic News saying this. Coincidentally, Intel also announced to have 3D technology sometime in May. Apple has a new contract chip manufacturer in the company of Taiwan Semiconductor Manufacturing Co. (TSMC). It is worth taking note that the A5 processor is made by Samsung.

“This pace would make the A6 one of the first 28 mobile processors to enter production. This schedule, however, breaks Apple’s annual processor-upgrade cycle and will delay any products using the A6 until at least June 2012,”  Krewell claims.

But if the iPad 3 is launched early in 2012, this will have to use the same A5 processor, just like the current iPad 2. Although there’s a rumor that it will be using the new high-resolution Retina display, predicts Krewell.

Krewell further predicts that the quad-core A6 will be at par with the best mobile processors of the following year. Notable of these is the expected quad-core offering of Nvidia. This chip is rumoured to power both  Android and Windows 8 devices. This necessarily includes both tablets and laptops. “Fabricating Apple’s A6 in 28nm (instead of the 40nm process Nvidia is using for its quad-core part) will reduce both die cost and power, yielding a much better product,” he said.

TSMC’s 3D technology for Apple’s A6 chip “could use 3D stacking to incorporate additional DRAM or flash memory, or to boost interconnect speed,” Krewell explains.

The author of the Linley Group’s report, Kevin Krewell, also said that the “3D Technology referred to in the Taiwan Economic News report is a way to stack and electrically connect die vertically. It could be used to connect memory die directly to the A6 SoC die. The Intel 3D technology is a transistor design where the transistor structure sticks out of the die (giving it a vertical dimension). Other chip manufacturers call it ‘FinFET’ to avoid confusion with other ’3D’ technologies.”